Semiconductor Engineering - Deep Insights For Chip Engineers
WEBSeptember 12th, 2024 By Adam Kovac. Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations & standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors.
Understanding Memory - Semiconductor Engineering
WEBFeb 15, 2018 · Memory technologies are often categorized by how data is stored (volatile or non-volatile) and accessed (random or sequential). In terms of function, there are two broad classes of memory: primary (main memory, or memory), which is the active type that works on data, and secondary (data storage), which provides long-term storage.
New Transistor Structures At 3nm/2nm - Semiconductor …
WEBJan 25, 2021 · Intel, Samsung, TSMC and others are laying the groundwork for the transition from today’s finFET transistors to new gate-all-around field-effect transistors (GAA FETs) at the 3nm and 2nm nodes, starting either next year or in 2023. GAA FETs hold the promise of better performance, lower power, and lower leakage, and they will be …
Semiconductor Engineering - knowledge-center
WEBA design or verification unit that is pre-packed and available for licensing. Separate electronic devices using Internet or other connections to communicate among the devices. Usually sensors or actuators are sending data to a computing hub. Semiconductor materials enable electronic circuits to be constructed.
Chip Industry Technical Paper Roundup: Oct. 1 - Semiconductor …
WEB14 hours ago · Chip Industry Technical Paper Roundup: Oct. 1. KAN for lightweight edge inference; bendable non-silicon RISC-V microprocessor; low-latency, energy-efficiency LLM inference; using both faces of polar semiconductor wafers; low-level SRAM cache 3DIC; formal verification; volatile memristors; 3D multilayer glass structure.
Hot Trends In Semiconductor Thermal Management
WEBNovember 17th, 2022 - By: Karen Heyman. Increasing thermal challenges, as the industry moves into 3D packaging and continues to scale digital logic, are pushing the limits of R&D. The basic physics of having too much heat trapped in too small a space is leading to tangible problems, like consumer products that are too hot to hold.
Where All The Semiconductor Investments Are Going
WEBNov 17, 2022 · Where All The Semiconductor Investments Are Going. Details on more than $500B in new investments by nearly 50 companies; what’s behind the expansion frenzy, why now, and challenges ahead. November 17th, 2022 - By: Ed Sperling. Companies and countries are funneling huge sums of money into semiconductor manufacturing, materials, and research ...
Top Stories Archives Semiconductor Engineering
WEBSep 19, 2024 · Striking A Balance On Efficiency, Performance, And Cost. Experts at the Table: Semiconductor Engineering sat down to discuss power-related issues such as voltage droop, application-specific processing elements, the impact of physical effects in advanced packaging, and the benefits of backside …
Emerging Technologies Driving Heterogeneous Integration
WEBSep 24, 2024 · Emerging Technologies Driving Heterogeneous Integration. New architectures, opportunities, and challenges as chipmakers move from monolithic architectures to chiplets. As chips are disaggregated into chiplets, more features are being added into these devices that chipmakers were unable to include in the past due to reticle size limits and the ...
Chip Industry Week In Review - Semiconductor Engineering
WEB4 days ago · Chip Industry Week In Review. Google’s AlphaChip; 300mm fab equip spending; TSMC-EDA partnerships; $123M CHIPS Act; CXL memory standards; MIPI’s A-PHY v2.0; 12-stack HBM3E; LLMs for chip design and manufacturing; India fab. September 27th, 2024 - By: The SE Staff. Global spending on 300mm fab equipment is expected to reach a record US$400 ...