Rust-resistant coating for 2D semiconductors; polymeric material for data storage and encryption; quantum-secure deep ...

Ensuring data gets to where it’s supposed to go at exactly the right time is a growing challenge for design engineers and ...

Why the chip industry is so focused on large language models for designing and manufacturing chips, and what problems need to ...

UMI to OCP as an extension to the BoW standard. While the improvements in processor performance to enable the incredible ...

Several critical processes address wafer flatness, wafer edge defects and what's needed to enable bonded wafer stacks.

A new technical paper titled “Using both faces of polar semiconductor wafers for functional devices” was published by ...

For many use cases, fine-tuning is the last step in turning a foundation model into a specialist resource. However, to ensure ...

A new technical paper titled “Impact of Strain on Sub-3 nm Gate-all-Around CMOS Logic Circuit Performance Using a Neural ...

Development methodologies combine old and new techniques, but getting any new material into high-volume manufacturing is a ...

A new technical paper titled “Hardware Acceleration of Kolmogorov-Arnold Network (KAN) for Lightweight Edge Inference” was ...

In the last decade, the use of ML/AI exploded in the areas of speech recognition, facial recognition, smart phone features, ...

Chiplet-based products must accommodate small differences in die size and bump pitch, placing new demands on manufacturing ...