Rust-resistant coating for 2D semiconductors; polymeric material for data storage and encryption; quantum-secure deep ...
Ensuring data gets to where it’s supposed to go at exactly the right time is a growing challenge for design engineers and ...
Why the chip industry is so focused on large language models for designing and manufacturing chips, and what problems need to ...
A new technical paper titled “Towards Fine-grained Partitioning of Low-level SRAM Caches for Emerging 3D-IC Designs” was ...
UMI to OCP as an extension to the BoW standard. While the improvements in processor performance to enable the incredible ...
A new technical paper titled “Using both faces of polar semiconductor wafers for functional devices” was published by ...
A new technical paper titled “Hardware Acceleration of Kolmogorov-Arnold Network (KAN) for Lightweight Edge Inference” was ...
A new technical paper titled “Bendable non-silicon RISC-V microprocessor” was published by researchers at Pragmatic Semiconductor, Qamcom, and Harvard University. From the abstract: “Here we present ...
Creating complex multi-chiplet systems is no longer a back-of-the-envelope diagram, but viable methodologies are still in ...
A Compact Behavioral Model for Volatile Memristors” was published by researchers at Technion – Israel Institute of Technology ...
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